Dow (NYSE:DOW) announced today the winners of the 35th Packaging Innovation Awards (PIA). The winners were unveiled during an awards ceremony held in conjunction with Tokyo Pack 2024, where the winning entries will be showcased from October 23 to 25. Prior to the awards ceremony, an international jury of 18 experts from across the packaging value chain convened in Bangkok this June to evaluate every nomination. From there, a shortlist of 28 winners was identified, selected for their ability … [Read more...] about Dow recognizes the winners for the 35th Dow Packaging Innovation Awards at Tokyo Pack 2024
Latest News
Nurasa’s vision for the future: Leading food tech innovation in Asia
By Cath Isabedra Unveiled last April 2024, Nurasa's Food Tech Innovation Centre (FTIC) is set to become a driving force for sustainable food innovation in Asia. With a mission to accelerate the commercialisation of groundbreaking and sustainable food products, Nurasa aims to establish the FTIC as a central hub for industry-leading solutions. According to Guo Xiuling, CEO of Nurasa, this initiative aligns perfectly with Singapore's ambitious 30-by-30 food security goals, aiming … [Read more...] about Nurasa’s vision for the future: Leading food tech innovation in Asia
Accelerating Climate Resilience and Nutrition in Asia: The Asia-Pacific Agri-Food Innovation Summit returns to Singapore on November 19-21, part of SIAW
Dr. Koh Poh Koon, Senior Minister of State for the Ministry of Sustainability and the Environment, will open the summit, addressing the audience of 1,000 influential stakeholders actively accelerating food security and access to nutrition. Asia is home to 60 percent of the world’s population, with 75 percent dependent on agriculture for their livelihood and food. Adverse weather events are detrimental to food production and supply worldwide, however, Asia’s diverse geography, partnered with … [Read more...] about Accelerating Climate Resilience and Nutrition in Asia: The Asia-Pacific Agri-Food Innovation Summit returns to Singapore on November 19-21, part of SIAW
